IMAPS - Key Persons
Job Titles:
- Secretary
- Member of Committee
Job Titles:
- Webmaster
- Member of Committee
Job Titles:
- Sales and Marketing Director
- Member of Committee
David King (Sales and marketing Director) joined Optocap in 2017 bringing a wealth of experience in high reliability microelectronics packaging technologies having worked in the industry for over 25 years. He began his career in engineering gaining 15 years' technical experience in design and product development before moving into sales and business development. He has held roles with responsibilities for high-reliability microelectronics and optoelectronics projects in the UK, Europe and the USA for demanding applications such as aerospace & defence, space, medical, oil & gas & power. David holds a BSc in Electronics & Physics from the Open University.
Dr Jayakrishnan Chandrappan is the head of Advanced packaging group at CSA Catapult providing innovative packaging solutions through package design & modelling, micro-assembly and rapid prototyping for Power Electronics, RF and Photonics applications. Jay's expertise ranges from Material engineering, Microelectronics, Photonics, Advanced packaging and reliability testing. Before joining the team at CSA Catapult, Jay's career includes roles at companies such as Global Foundries Inc., A-Star Institute of Microelectronics, Singapore, and Scientist, Ministry of Electronics & Information Technology, India. He is a recipient of Europe's most prestigious Marie-Skłodowska-Curie fellowship and won the Royal Society of Chemistry ‘Emerging Technology Showcase' award in 2015.
Job Titles:
- Membership Secretary
- Member of Committee
Job Titles:
- - UK Trustee
- Member of Committee
- Treasurer & past Chair
- Trustee, STFC, Didcot OX11 0QX
Job Titles:
- Vice Chair
- Member of Committee
Job Titles:
- - UK Trustee
- Member of Committee
- Trustee, Inseto ( UK ) Limited, Andover SP10 5NY
Job Titles:
- - UK Trustee
- Member of Committee
- Trustee, Connexion Technologies Ltd, Kingsbridge TQ7 4BP
Piers Tremlett has over 20 years experience working in the development of new packaging processes and designs within Microsemi's Advanced Packaging Business and previously with Lucas Automotive, Sensors and Controls. He holds a BSc in Metallurgy & Material Science and an MSc in Management, Manufacturing and Technology. He is Microsemi's senior Microelectronics Packaging Specialist with experience in System in a Package, PCB embedded die and high temperature electronics packaging.
Job Titles:
- Chairman
- Member of Committee
Job Titles:
- Director Tribus - D Ltd
- Member of Committee
: Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge. He has over 30 years of experience in electronics assembly innovation, proposal generation and project management. Technical developments have included copper wire bonding, laser processes, high temperature electronics, MEMS assembly, ruggedised displays and LED lighting working at The Welding Institute and GE Aviation Systems in Newmarket. He has instigated and managed several Innovate UK/European projects, working collaboratively with a wide range of industrial and academic partners. He left GE Aviation in December 2015 and is now a director at a start-up business, Tribus-D Ltd, working on developing electronic packaging and interconnection technologies.
Job Titles:
- - UK Trustee
- Member of Committee
- Trustee, MCS, Roslin EH25 9RE