Updated 4 days ago
9909 Hibert St., Suite A San Diego, CA 92131
Our experts perform dicing services for a wide range of substrate materials, ranging from silicon to fused silicon, glass, ceramic and more. In addition to dicing, our innovative approaches to wire bonding allows us to complete wedge bonding, ball bonding and die bonding for customized assembly of microelectronics...
Advanced International Technology of San Diego provides precision wafer processing, wire bonding, micro assembly fabrication services.