SI2 - Key Persons
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- Program Manager / Member Services
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- Vice President / Engineering / Siemens
- Vice President of Engineering, Siemens EDA
Anant Adke, vice president of Engineering, Siemens EDA, has been elected to the Silicon Integration Initiative board of directors. He replaces Juan Rey, who retired from Siemens EDA in December.
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- Chief Strategy Officer
- Vice President and Chief Strategist, Ansys
- Vice President and Chief Strategist, ANSYS Inc
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- Senior Product Marketing Group Director at Cadence Design Systems
Aparna Dey, senior product marketing group director at Cadence Design Systems, has been elected to the Silicon Integration Initiative board of directors. She replaces Stan Krolikoski who served on Si2's board since 2016.
Dey is responsible for the Cadence electronic design automation and intellectual property standards activities. She also manages the participation, contribution, partnerships and relationships between Cadence and industry standards organizations, associations, and consortiums. She has been at Cadence for over 16 years in various roles in research and development, services and technical marketing.
"Si2 has been committed to driving standards interoperability that moves the IC design industry forward, and I'm passionate about working with them to continue this effort, Dey said. "Over the years, I've collaborated with Si2 on standards development and participated in various coalitions. I look forward to serving on the Si2 board of directors to foster EDA interoperability and support IC design industry ecosystem growth through standards solutions."
Before her current role, Dey was responsible for driving ASIC alliance partnerships and critical technology deployments with Cadence's leading customers. As a senior architect in the Cadence Worldwide Methodology Services Group, she worked on multiple methodology projects on-site in Japan, Taiwan and Germany.
She also worked as an advanced R&D director at Synchronicity and was responsible for their technology strategy, product roadmap and requirements for their next-generation design database and IP management products. She was awarded a US and European patent on their Silicon IP Reuse system.
Dey holds a bachelor's degree in electronics and telecommunication engineering from Netaji Subhas Institute of Technology, University of Delhi, India.
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- Group Director, Cadence Design Systems
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- Member of the Board
- Co - Design ( Open3D )
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- Principal Software Design Engineer
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- Corporate Vice President
- Corporate Vice President, Electronics Design Technology, Samsung Electronics
- Directors
A 17-year Samsung veteran, Choi leads the team responsible for developing all design tools and methodologies for Samsung memory products: technologies and environments impacting product values, new process and package technologies, new applications and new working environments such as the Cloud.
Since joining Samsung, he has contributed to the development of low-power design methodologies for mobile devices, RTL-to-GDS implementation and sign-off methodologies.
Choi joined Samsung Electronics in 2003 after receiving his doctorate in electrical engineering at the Pohang University of Science and Technology, Republic of Korea. He was a visiting scholar at Stanford University in 2012.
Jung Yun Choi, corporate vice president for the Samsung Electronics Design Technology team, has been elected to the Silicon Integration Initiative board of directors.
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- Secretary of the Board
- Distinguished Member of the Technical Staff, Analog Technology Development, Texas Instruments
- Distinguished Member of the Technical Staff, Texas Instruments
The board elected prior board member, John Lee, general manager and vice-president, Ansys, as an ex-officio board member. Lee will advise the board with regards to Si2's long-term strategy for design-in-the-cloud, as well as for artificial intelligence and machine learning-enabled design.
The Si2 board represents leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers. Si2's key programs include OpenAccess, a standard application programming interface and reference source code for the design database used by all major chip design software suppliers, and the Compact Model Coalition, which selects and supports industry-standard SPICE simulation models.
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- Vice President
- Director of OpenStandards
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- Vice President
- Vice President, Electronic Design Automation Technologies, IBM
- Vice President, Electronic Design Automation Technologies, IBM ( NYSE
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- Senior Director, Design Enablement, GLOBALFOUNDRIES
- Senior Vice President / Design and Technology Enablement
- Vice President, Design Enablement, GLOBALFOUNDRIES
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- Engineer, Google
- Google Hardware Engineer
- Hardware Engineer
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- Named IBM Representative to Si2 OpenAccess Coalition
Hongmei Li is the new IBM representative to the Si2 OpenAccess Coalition. Li currently manages the Product Design Enablement Group in the IBM electronic design automation organization. She replaces Paul Stabler, a long-time supporter of OpenAccess activities, who is retiring from IBM. Over her 17-year IBM career, Li has worked on radio-frequency MOSFET and passive […]
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- Chief Strategy Officer, Zuken
- Chief Strategy Officer, Zuken, Inc
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- Chairman of the Board
- Intel Elected Board Chair
- Vice President and Director of R & D Strategic Enablement at Intel
- Vice President and General Manager / Product and Design
- Vice President, Intel Corp., Director, R & D Strategic Enablement
- Vice President, Technology and Manufacturing Group and Director, EDA Business, Intel ( NASDAQ
- Vice President, Technology and Manufacturing Group and Director, Research and Development Strategic Enabling
- Vice President, Technology and Manufacturing Group and Director, Research and Development Strategic Enabling, Intel Corp
AUSTIN, Texas - Rahul Goyal of Intel has been elected to a one-year term as board chair of Silicon Integration Initiative, a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools. The election was held during Si2's board meeting at the recent Design Automation Conference.
A member of the Si2 board since 2003, Goyal is vice president, Technology and Manufacturing Group and director, Research and Development Strategic Enabling for Intel. He has global responsibility for strategic sourcing, supply chain strategy, industry relations, ecosystem development, strategic collaborations, data analytics, and capacity management related to product development across Intel's broad product portfolio. This includes software, system and semiconductor intellectual property, product development outsourcing services, electronic measurement solutions, Electronic Design Automation software, prototyping and verification products used in all aspects of product design, validation and technology development.
Goyal joined Intel in 1989 and has held various technical and management positions in software engineering and technology development. His previous roles there include engineering director in the Design and Technology Solutions Group, director of the integrated silicon technology roadmap development in the Microprocessor Products Group, and senior engineering manager of mask operations. Goyal holds a bachelor's degree in electrical and electronics engineering from Birla Institute of Technology and Science in Pilani, India, and a master's degree in computer engineering from Syracuse University in New York.
Job Titles:
- Senior Vice President / Engineering
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- Technical Advisor
- Director of OpenStandards
- Director of Si2 OpenStandards
- Director of the OpenStandards Coalition
Jerry Frenkil, director of Si2 OpenStandards, said the IBM and GF contributions bolster UPM and provide P2416 with proven and ready-to-use modeling methods. "These power proxies enable voltage and temperature-independent modeling which greatly reduce the model generation and support effort," Frenkil explained. "They also enable late binding of voltage and temperature conditions at simulation run-time, a major benefit for both IP developers and SoC designers."
Jerry Frenkil, director of the OpenStandards Coalition, which incubates new Si2 standards, said development of the Si2 UPM is part of the industry's ongoing effort to improve energy and power efficiency throughout the system-on-a-chip development flow, with a focus on system design.
Jerry Frenkil, Si2 director of OpenStandards, said that the Si2 Low Power Working Group developed the new technology to fill several holes in the flow for estimating and controlling SoC power consumption. "This new modeling technology provides accurate and efficient, early estimation of both static and dynamic power, including critical temperature dependencies, using a consistent model throughout the design flow. There's currently no standard way to represent power data for use at the system level, especially across a range of process, voltage and temperature points in a single model."
John Ellis, Si2 president and CEO, said that Google's membership on the Si2 board reflects the increasing impact of vertical integration in the electronics industry. "A recent Si2 industry survey showed that over 80 percent of our end users develop some specialized, internal design tools. This proprietary software meets their unique needs and performance requirements," Ellis said.
John Ellis, Si2 president and CEO, said, "John's experience as a successful serial entrepreneur brings unique insights to the board of directors. He is well known in the industry, and the members of our board who have worked with him hold his judgment in high regard. He is a welcome addition to the team."
John Ellis, Si2 president and CEO, said Dey has an "impressive record of achievement in her more than 25 years in the industry that makes her an ideal addition to the Si2 board. Aparna has volunteered on various Si2 committees since 2003 and has earned the respect of our staff and her colleagues. Most notably, she has been involved with and supported our flagship coalition, OpenAccess, since its inception."
John Ellis, Si2 president and CEO, said Goyal's re-election "provides sustained leadership as we continue to advance with our members into artificial intelligence and machine learning, 5G, and autonomous vehicles, as well as assure continuity and stability during the disruption that COVID has inflicted on our industry."
John Ellis, Si2 president and CEO, said, "Doctor Choi brings a unique, IDM and foundry perspective to Si2. His in-depth understanding of fundamental semiconductor principles, along with his hands-on experience in product development, including our current thrust in system-level power modeling for low-power design, will be extremely valuable as we develop our direction for the future."
John Ellis, president and CEO, said Kukkal brings crucial experience and domain knowledge to the Si2 board. "Pankaj has been in key, strategic roles at Qualcomm and Intel over his long career. The insights he has gained, along with his extensive network of contacts including former associates, customers and suppliers in the semiconductor industry, will be invaluable as Si2 and its board maps out where the industry is going, and what Si2 members need from us to help propel them there most efficiently."
John Ellis, Si2 president and CEO, said Goyal's reelection "will assure leadership continuity as we expand support for our members into such advanced technologies as artificial intelligence, machine learning, and design in the cloud."
Job Titles:
- General Manager and Vice - President, Ansys
- General Manager and Vice President of the Ansys Electronics
John Lee, general manager and vice president of the Ansys Electronics and Semiconductor Division, has been elected to the Silicon Integration Initiative board of directors. He replaces Vic Kulkarni, who retires from Ansys this month.
Lee co-founded and served as CEO of Gear Design Solutions, which was acquired by Ansys in 2015. Gear Design developed the first purpose-built big data platform for integrated circuit design. Lee had previously co-founded Mojave Design, which was acquired by Magma Design Automation and later purchased by Synopsys in 2012. His first startup, Performance Signal Integrity, was acquired by Avanti, and then by Synopsys.
"I have seen firsthand how vital interoperability is to our customers and how it benefits the entire electronics design ecosystem," said Lee. "I am honored by this opportunity to contribute to Si2 and look forward to joining my fellow board members in advancing its important mission."
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- Vice President, Design Technology Team, Samsung Electronics ( OTC
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- Vice President, Engineering, Qualcomm Technologies, Inc. ( NASDAQ
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- Vice President of Engineering, Calibre, Siemens EDA
- Vice President of Engineering, Mentor, a Siemens Business
Julien Sebot, CPU architect at Intel and a member of the IEEE P2416 Working Group, added, "The Si2 contribution addresses the top priorities identified by the P2416 Working Group. The ability to create accurate, early estimates and to reuse and refine those estimates during the design process is essential in creating energy efficient systems-on-chip. Si2's contribution is a major step toward addressing that need."
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- Copywriter and Programs Marketing
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- Board Treasurer / Senior Director of Technical Standards
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- Executive
- Technical Assistant
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- Senior Director
- Director, Production Standards
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- Corporate Vice President / Research and Development / Cadence Design
Michaela Guiney, who recently retired after an 18-year career with Cadence Design Systems, has received the quarterly Silicon Integration Initiative Pinnacle Award, recognizing volunteers for their exceptional contributions to Si2's success as a leading semiconductor research and development joint venture. Guiney's latest role at Cadence was senior software architect, working on IC custom design software, […]
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- Director of Product Marketing for Analog / Mixed - Signal / RF IC Verification Solutions, Mentor, a Siemens Business
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- Senior Technical Staff Member at IBM
Nagu Dhanwada, senior technical staff member at IBM, chairs both the IEEE P2416 and Si2 Power Modeling Working Groups. According to Dhanwada, "This is a major contribution to the P2416 effort. As the first technology contribution to the P2416 Working Group, it's expected to form a solid foundation for the resulting standard."
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- Vice President of Engineering, CDMA Technologies Division, Qualcomm ( NASDAQ
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- Chairman of the Board
- Executive Vice President
- Vice President of Engineering at Qualcomm Inc
- Vice President, EDA, Emulation and Post - Silicon Engineering, Qualcomm Technologies
Pankaj Kukkal, vice president of Engineering at Qualcomm Inc., has been elected to the Silicon Integration Initiative board of directors. Si2 is a leading research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.
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- Computer and Information Systems Manager
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- General Manager, Place and Route Division, Mentor Graphics Corp. ( NASDAQ
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- Accounting and Office Manager
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- Vice President of the Samsung Electronics Design Technology Team
Seungbum Ko is vice president of the Samsung Electronics Design Technology Team. He is responsible for all memory design methodology activities for the Samsung memory division, and also manages the relationships between memory division and EDA vendors. A 21-year veteran at Samsung, Ko's expertise includes development of SDRAM, DDR, DDR2, DDR3, LPDD2, LPDDR3 and LPDDR4 devices. His internal honors include the Proud Samsung Award, the Jang Young-sil Award, and the Memory Award.
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- Fellow, Ecosystems, Cadence Design Systems
- Fellow, Strategic Alliances, Cadence Design Systems
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- Senior Director, Design Infrastructure Marketing Division, Taiwan Semiconductor Manufacturing Co. ( NYSE
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- Vice President, Corporate Marketing
- Corporate Vice President, Strategic Initiatives and Market Intelligence, Synopsys
- Vice President, Corporate Marketing, Synopsys ( NASDAQ
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- Member Services Manager
- Marketing Advisor
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- Senior Vice President, Custom IC & PCB Group, Cadence Design Systems ( NASDAQ
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- Vice President of Engineering at Qualcomm Technologies
Udi Landen is Vice President of Engineering at Qualcomm Technologies, Inc. In his current role, Landen provides technical, management and business leadership for engineering teams at various international sites that focus on mobile and computing design enablement and CAD methodology automation roadmaps. Prior to joining Qualcomm in 2013, Landen held executive and leadership roles at Altera Corp., Mercury Interactive and Cadence Design Systems. He is a graduate of the Technion, Israel Institute of Technology.