WESTBOND

Since 1966, WEST•BOND has designed and manufactured a renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry... We are perhaps best known for our patented single input X-Y-Z micromanipulator. This unique mechanism of our manual and semi-automatic series machines provides exceptional ease of operation and versatility of application. It accepts the inputs at which humans excel, and continues with the execution of programs of user data under operator and/or digital motor control. In our automatic series machines, data input is via a graphical user interface, and alignment verification is by optical pattern recognition... Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories..

Also known as: WestBond, Inc.

Primary location: Anaheim United States