CHIPS

UCLA CHIPS has pioneered the dielet revolution and develops new methodologies and infrastructure for integrating dielets (sometimes also called chiplets) at pitches comparable to on-chip wiring levels, enabling both latencies, bandwidth and energy per bit comparable to monolithic integration, but at the board level. UCLA CHIPS is also developing the enablement infrastructure including thermal, communication, test, repair and supply chain to realize this paradigm shift. We have developed integration platforms for both rigid electronics based on silicon as well as flexible platforms based on bio-compatible materials. We also apply monolithic 3D integration using wafer-to-wafer bonding for memory scaling and cognitive applications. The ability to hardware synthesize extremely large systems from prefabricated hard IP will reduce turn-around times from years to weeks and costs from tens of millions to a few hundred thousand dollars. We believe this paradigm shift will change the way systems..

Also known as: UCLA Engineering