ICEPT

The International Conference on Electronic Packaging Technology (ICEPT) is the largest and most cohesive packaging technology conference in Asia, which is hosted by Shanghai University, IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of Chinese Institute of Electronics (CIE-EMPT). Organized by National Center for Advanced Packaging (NCAP) , and BeiJing HengRenZhiXin Consulting Company, China. ICEPT held in China every year, conference topics including Packaging Design, Manufacturing Technologies、R&D, and Photonics、MEMS、System Integrated Packaging etc..., since it inaugurated in 1994, ICEPT has been held by Tsinghua University, Peking University, Fudan University, Harbin Institute of technology, Huazhong University of science and technology, Shanghai Jiaotong University, Xi'an University of Electronic Science and technology, Shanghai University, Guilin University of Electronic Science and technology, Dalian University of..

Also known as: Beijing Faith Information Consultant, Beijing Faith Information Consultant Ltd, International Conference on Electronic Packaging Technology