ICEPT - Key Persons
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Institute of Microelectronics of the Chinese Academy of Sciences
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- Member of the TECHNICAL COMMITTEE
- Huazhong University of Soience and Technology
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Professor of Guangdong University of Technology, China
Professor of Guangdong University of Technology （GDUT）and CEO of Guang Dong FoZhiXin microelectronics Technology Research Co.Ltd. He received his PhD in Chemistry from the University of Essex (ESSEX) in 1991, bachelor's and master's degrees in Department of Chemical Engineering , Tianjin University in 1983 and 1985, respectively. He has hosted various national R&D projects including national 02 project and 863 project. He has almost 30 years' experience in the development and production of microelectronic advanced packaging technology and materials, especially, high-density packaging substrates.
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- Member of the TECHNICAL COMMITTEE
- Distinguished Professor of Xiamen University，Founder of Xiamen Sky Semiconductor Co., Ltd
Dr. Daquan Yu is a Distinguished Professor of Xiamen University and the founder of Xiamen Sky Semiconductor Co., Ltd. He was the President of Research Academy of Advanced Packaging Technology of TSHT Group from 2014 to 2019. Before that, he was a professor of Institute of Microelectronics, Chinese Academy of Sciences from 2010 to 2015. He had carried out research work at Fraunhofer IZM in Germany, and Institute of Microelectronics in Singapore from 2005 to 2010. He has authored or co-authored more than 200 peer-reviewed technical publications and holds more than 70 patents.
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- Member of the TECHNICAL COMMITTEE
- Executive Vice - President of School of Microelectronics, Dalian University of Technology, China
- Professor
Professor Hongwei Liang, Vice Dean of School of Microelectronics, Dalian University of Technology, Director of Dalian Key Laboratory of Wide Bandgap Semiconductor Device Integration and System. He received his Ph.D. from Chinese Academy of Sciences. He is currently a member of the Nuclear Electronics and Nuclear Detection Technology Branch of the Chinese Institute of Electronics and a member of the Young Scientists Club, and a special expert of the Expert Committee of the Talent Reserve Base of the Integrated Circuit Branch of the China Semiconductor Industry Association.
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- Member of the TECHNICAL COMMITTEE
- Tenured Professor at the Harbin Institute of Technology，Vice Director of the State Key Laboratory of Advanced Welding and Joining
Dr. Yanhong Tian is currently a Tenured Professor at the Harbin Institute of Technology and the vice director of the State Key Laboratory of Advanced Welding and Joining. She is a National High-level Talent, received the Excellent Young Scientists Fund of the National Natural Science Foundation of China, and the Funding of New Century Excellent Talents from the Ministry of Education of China. Her research interests are advanced packaging technology and reliability, flexible printed electronic materials and devices.
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- Member of the TECHNICAL COMMITTEE
- Chief Engineer of Fairchild, USA
Dr. Yong Liu has been with ON Semiconductor Corp in South Portland, Maine since Sept, 2016 as a Principal Member of Tech Staff. Before Fairchild was acquired by ON Semiconductor, he worked at Fairchild Semiconductor as a Distinguished Member Technical Staff. His main interest areas are advanced analog and power electronic packaging, modeling and simulation, reliability and material characterization. He was elevated as IEEE fellow in 2015.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Huazhong University of Science and Technology, China
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- SANECHIPS TECHNOLOGY CO
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- Member of the TECHNICAL COMMITTEE
- China Wafer Level CSP Co
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- Member of the TECHNICAL COMMITTEE
- Heraeus Materials Technology Shanghai Ltd
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Dean of the College of Mechanical and Electrical Engineering, Shihezi University
Leading figure in the field of agricultural engineering. He is council member of the Chinese Society of Agricultural Engineering, Animal Husbandry Engineering Branch of China Agricultural Engineering Society, Agricultural Society of Xinjiang Uygur Autonomous Region, and a committee member of the Agricultural Mechanization Branch of the Chinese Society of Agricultural Machinery. His research interests are developing and applying the key technologies and equipment for the mechanical production of Xinjiang specialty crops, key technologies and equipment for livestock breeding, and image acquisition and processing systems.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
Chairs Fengman LIU Professor of Institute of Microelectronics of Chinese Academy of Sciences（CAS）,China Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book. Daoguo YANG Professor of Guilin University of Electronic Technology、Duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices、Director of Guangxi Electronic Packaging and assembly technology Engineering Research Center. Prof. Daoguo Yang received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology (TUDelft), the Netherlands. He is currently a professor of Guilin University of Electronic Technology and the duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices and the director of Guangxi Electronic Packaging and assembly technology Engineering Research Centre. Members Pei CHEN Beijing University of Technology, China Haibo FAN Nexperia Hong Kong, HK, China Hu HE Central South University, China Hua LU Greenwich University, UK Jun LI IMECAS, China Xu LONG Northwestern Polytechnical University, China Min MIAO Beijing Information Science and Technology University, China Hongbo QIN Guilin University of Electronic Technology, China Hongbin SHI Huawei Technologies Co. Ltd, China Lei SHAN IBM，USA Xingchang WEI Zhejiang University, China Jun WANG Fudan University, China Tonglong ZHANG Huawei Technologies Co. Ltd, China Xinping ZHANG South China University of Technology, China Xiaowu ZHANG Institute of Microelectronics (IME),Singapore
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- Chairman and President of TongFu Microelectronics Co., Ltd
PhD from Fudan University, Senior Engineer, State Council Special Allowance Expert, National Thousand Talents Plan Expert, and Innovative Leading Talent of the Ministry of Science and Technology. The current Chairman and President of TongFu Microelectronics Co., Ltd., Director of National Enterprise Technology Center, Director of Jiangsu Province Advanced Packaging and Testing Key Laboratory, and Dean of Tongfu Microelectronics Research Institute. He also serves as the Executive Vice Chairman of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Alliance, Vice Chairman of the China Semiconductor Industry Association, Current Chairman of the Packaging and Testing Branch of the China Semiconductor Industry Association, Evaluation Expert of the National Science and Technology Major Project 02 Special Professional Group, Jiangsu Province Second Industry Professor, and Industry Professor at Nanjing University of Posts and Telecommunications and Nantong University.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
Mr. Zheng Li is a member of the board of directors and Chief Executive Officer at JCET Group Co., Ltd. JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly and final test.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Xiamen University of Technology
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
Chairs Jintang SHANG Prof. of Southeast University From 2008 to 2009, As a visiting scholar, he went to the Microsystem Packaging Research Center at Georgia Institute of Technology in the United States. Currently, he is a professor and doctoral supervisor at the School of Electronic Science and Engineering, Southeast University. Main research interests include the manufacturing and packaging of microelectronic mechanical systems (MEMS), biological and nanomanufacturing and packaging, integrated circuit (IC) system integration packaging technology, and advanced packaging materials for microelectronic systems. Ke XIAO Shanghai Institute of Microsystems, CAS As a senior expert in the field of electronic packaging, he graduated from Tsinghua University with a bachelor's degree in Materials Science and Engineering, and later obtained a doctoral degree from the Shanghai Institute of Microsystems, Chinese Academy of Sciences.He has held technical development and management positions in well-known companies such as Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Intel, RFMD, etc., and has formed technical and operational teams multiple times. He has also published multiple packaging technology papers and related patents. Members Jian CUI Peking University Zhikuang CAI Nanjing University of Posts and Telecommunications Yuzhe HUANG ASE Group Huizhong LIU ASE Group Guangbao SHAN Xidian University Shijie TANG ASE Group Lixi WANG Nanjing Tech University Tianchi WANG Nanjing University of Science and Technology Yihong WU ASE Group Libo ZHAO Xi'an Jiaotong University Wenwen KONG Xinjiang Institute of Physical and Chemical Technology, Chinese Academy of Sciences
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- Member of the TECHNICAL COMMITTEE
Chairs Jintang SHANG Prof. of Southeast University From 2008 to 2009, As a visiting scholar, he went to the Microsystem Packaging Research Center at Georgia Institute of Technology in the United States. Currently, he is a professor and doctoral supervisor at the School of Electronic Science and Engineering, Southeast University. Main research interests include the manufacturing and packaging of microelectronic mechanical systems (MEMS), biological and nanomanufacturing and packaging, integrated circuit (IC) system integration packaging technology, and advanced packaging materials for microelectronic systems. Ke XIAO Shanghai Institute of Microsystems, CAS As a senior expert in the field of electronic packaging, he graduated from Tsinghua University with a bachelor's degree in Materials Science and Engineering, and later obtained a doctoral degree from the Shanghai Institute of Microsystems, Chinese Academy of Sciences.He has held technical development and management positions in well-known companies such as Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd., Intel, RFMD, etc., and has formed technical and operational teams multiple times. He has also published multiple packaging technology papers and related patents. Members Jian CUI Peking University Zhikuang CAI Nanjing University of Posts and Telecommunications Yuzhe HUANG ASE Group Huizhong LIU ASE Group Guangbao SHAN Xidian University Shijie TANG ASE Group Lixi WANG Nanjing Tech University Tianchi WANG Nanjing University of Science and Technology Yihong WU ASE Group Libo ZHAO Xi'an Jiaotong University Wenwen KONG Xinjiang Institute of Physical and Chemical Technology, Chinese Academy of Sciences
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Executive
- Professor and Executive
Mei Yunhui is a professor and executive dean of the School of Electrical Engineering, Tiangong University. He has long been engaged in the research of power electronic device packaging and reliability. In recent years, he has presided over more than 30 projects, including the national science foundation of China (NSFC) outstanding youth fund project, the Tianjin municipal distinguish youth fund project, the national defense project, aviation fund, Huawei, Azure Automobile, Huichuan Technology, etc. He has also participated in the key projects of the National Fund, 863 projects. He is the director of the China Power Supply Society, deputy director of the Component Committee, deputy director of the Expert Advisory Committee, IEEE Senior Member, editorial board member of the Journal of Power Supply, deputy director of the Tianjin Power Supply Society, etc.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- ChangXin Memory Technologies, Inc
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- Member of the TECHNICAL COMMITTEE
Chairs Fengman LIU Professor of Institute of Microelectronics of Chinese Academy of Sciences（CAS）,China Fengman Liu received the Ph.D.degree in Microelectronics and Solid-State Electronics from the Institute of Semiconductor of CAS. His research interests include System in Packaging，Wafer level packaging and optoelectronics hybrid integration. Prof. Fengman Liu has led and joined a number of research projects, including the National Key R&D Program of China, NSFC funding and and projects from enterprises. he has published over 60 papers ,hold over 30 patents and co-authored one book. Daoguo YANG Professor of Guilin University of Electronic Technology、Duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices、Director of Guangxi Electronic Packaging and assembly technology Engineering Research Center. Prof. Daoguo Yang received his Master degree from Zhejiang University, China, and Ph.D. from Delft University of Technology (TUDelft), the Netherlands. He is currently a professor of Guilin University of Electronic Technology and the duty director of Engineering Research Centre of the Ministry of Education for Electronic Information Materials and Devices and the director of Guangxi Electronic Packaging and assembly technology Engineering Research Centre. Members Pei CHEN Beijing University of Technology, China Haibo FAN Nexperia Hong Kong, HK, China Hu HE Central South University, China Hua LU Greenwich University, UK Jun LI IMECAS, China Xu LONG Northwestern Polytechnical University, China Min MIAO Beijing Information Science and Technology University, China Hongbo QIN Guilin University of Electronic Technology, China Hongbin SHI Huawei Technologies Co. Ltd, China Lei SHAN IBM，USA Xingchang WEI Zhejiang University, China Jun WANG Fudan University, China Tonglong ZHANG Huawei Technologies Co. Ltd, China Xinping ZHANG South China University of Technology, China Xiaowu ZHANG Institute of Microelectronics (IME),Singapore
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- Member of the Board of Directors and Chief Executive Officer at JCET Group Co
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Deputy Director
- Member of the TECHNICAL COMMITTEE
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- Head of Laboratory for Electronic Packaging Materials
Prof. Dr. Mingliang Huang, Head of Laboratory for Electronic Packaging Materials, Dean of School of Materials Science & Engineering of Dalian University of Technology, Dalian, China. Experts in the national plan for ten thousand people, Young and Middle-aged talents in Science and Technology Innovation of the Ministry of Science and Technology, Humboldt Fellow. Research interest focuses on the advanced interconnection technology and materials in electronic packaging.
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- Member of the TECHNICAL COMMITTEE
- Senior Researcher and Associate Professor in Southern University of Science and Technology ( SUSTech )
Prof. Huaiyu Ye, has received BS degree in Shanghai Jiao Tong University, China, MA degree and Ph.D. degree in Delft University of Technology, the Netherlands (TUDelft). Currently, he is Senior Researcher and Associate Professor in Southern University of Science and Technology (SUSTech). He has worked in Materials innovation institute (M2i) and Netherlands Organisation for Applied Scientific Research (TNO) in Europe. He has also worked in Chongqing University as Senior Researcher from 2016 to 2019. He is the committee member of the IEEE International Technology Roadmap for Wide Bandgap Power Semiconductors (ITRW), Power Electronics Committee of the Chinese Electrical Engineering Society, and ICEPT, CSEE, EuroSimE, China SSL & IFWS.
Prof. Jianhua Zhang is the executive dean of School of microelectronics, Shanghai University. She won the National Science Fund for Distinguished Young Scholars in 2018. She is Yangtze River Scholar Distinguished Professor, Young and Youth Science and technology Innovation Leader s for scientific and technological innovation in the national 'ten thousand talents plan', and Science and Technology Innovation Leader.
Prof. Wenhui Zhu is professor with Central South University, China and Founder of Changsha AMQ Intelligent Technology Pte Ltd. He was elected as National Elite Talent. Previously he was Chief Technology Officer of Tian Shui Hua Tian Technology Co. Ltd, CEO of Kun Shan Q Technology Limited Co. He was Chief Scientist of 973 program on IC wafer level 3D integration, and has been working in TSV packaging, DFR (design for reliability), DFM (design for manufacturability) and DFP (design for performance), packaging materials and 3D nano-/micro-electronics packaging in leading semiconductor and packaging companies including Infineon and UTAC.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Director of Packaging and Integration R & D Center in the Institute of Microelectronics of the Chinese Academy of Sciences
Dr. WANG Qidong received his B.S. degree in Electronics Engineering from Southeast University in Nanjing, MSc degree from Nottingham University in UK, Ph.D degree in Microelectronics and Solid-State Electronics from University of Chinese Academy of Sciences. He worked in Varian Lab, Stanford University as a Visiting Scholar from 2015 to 2016. He currently serves as the Director of Packaging and Integration R&D Center in the Institute of Microelectronics of the Chinese Academy of Sciences.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Director of the Institute of Advanced Materials Science
- Professor and Director of the Institute of Advanced Materials Science
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- Member of the TECHNICAL COMMITTEE
- VP of Central Development Engineering in ASE ( Advanced Semiconductor Engineering )
Scott received B.S. degree in Chemical Engineering from NTU (National Taiwan University). And Master degree of Executive MBA Program from NTU. He has been worked on each of assy technology , MEMS nsor, bumping, flip chip , advance package technology and SIP solution over 30 yrs.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Full Professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University
He has worked in the University of Michigan (US), Waseda University (Japan), and Northwestern University (US) as the visiting scholar and postdoctoral fellow for 5 years. Currently, he is a full professor in the School of Materials Science and Engineering at Shanghai Jiao Tong University. His research interest mainly focused 3D packaging materials and technology (interconnection, low temperature bonding), nanostructured materials and functional thin films fabricated by electrochemical method (electrodeposition, electro-grafting, electrochemical-etching).
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- General Manager of Yan Tai Darbond Technology Co., Ltd., China
Tim CHEN, National level overseas high-level expert, member of the Advisory Committee of the National Integrated Circuit Material Industry Technology Innovation Strategy Alliance, director and member of the Expert Advisory Committee of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategy Alliance, has undertaken the National Science and Technology Major Project "Research and Industrialization of Bottom Filling Materials for Low k Inverted Core TCB Process" (02 Project), Hosted the National Key R&D Program project "Application Research on Underfill Materials for Narrow Gap Large Size Chip Packaging". In May 2010,Tim joined Darbond Technology Co., Ltd., and has served as a director and general manager of Darbond Technology Co., Ltd., executive director of Darbond Technology (Shenzhen) Co., Ltd., chairman of Weishida Semiconductor Technology Co., Ltd., and chairman of Darbond Technology (Dongguan)Co., Ltd.
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- Member of the TECHNICAL COMMITTEE
- Huawei Digital Power Technology Co
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- Member of the TECHNICAL COMMITTEE
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- Chief Engineer
- Member of the TECHNICAL COMMITTEE
Xiaofeng YANG Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT.
Xiaofeng YANG, received his M.Sc. and Ph.D. degrees from Xiamen University, Xiamen, China, in 2016 and 2020. Currently, he is a Chief Engineer of advanced packaging and microsystem reliability ttechnology in the Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, the 5th Institute of MIIT. His main research interests include advanced packaging reliability technology, thermal-mechanial reliability, advanced sensing technology and flexible electronics.
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- Member of the TECHNICAL COMMITTEE
- Beijing University of Technology
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- South China University of Technology, China
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- China Key System & Integrated Circuit Co
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Shanghai Yibu Semiconductor Co., Ltd., Executive Vice President
Guo obtained a Ph.D. in Engineering Science in the United States in 1988. Afterwards, Guo worked for many years at globally renowned high-tech companies such as IBM, Motorola, Skyworks, and ASE. Dr. Guo obtained a Master of Business Administration (MBA) degree in the United States in 2005 and currently serves as the Executive Vice President of Yibu Semiconductor Co., Ltd.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Sichuan Institute of Aerospace Electronic Equipment
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE
- Master Supervisor of Guangdong University of Technology
In January 2016, ZHANG graduated from Shenzhen Institute of Advanced Technology, University of Chinese Academy of Sciences as Ph.D. , core member of "State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Jointly Built by the Ministry of Education" and "Key Laboratory of Microelectronic Precision Manufacturing Technology and Equipment", and Class A talents introduced by the University's "100 Young Talents Program".He is mainly engaged in the research and development of advanced semiconductor packaging technologies and key materials such as microelectronics and power electronics, including micro-nano metal materials, flexible printed electronics, high-density three-dimensional interconnection technology and key materials.
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- Member of the TECHNICAL COMMITTEE
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- General Manager of Huatian Technology ( Kunshan ) Co., Ltd., China
Leading talents in the "Double Innovation Team" in Jiangsu Province and the "Double Innovation Team" in Kunshan City, as well as "Jiangsu Science and Technology Entrepreneurs". Vice Chairman of China Semiconductor Industry Association, President of Kunshan Semiconductor Industry Association, and Expert of Jiangsu Province High end Equipment Expert Database.
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- Member of the TECHNICAL COMMITTEE
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- Member of the TECHNICAL COMMITTEE