AMTECH MICROELECTRONICS

AmTECH Microelectronics was established over 30-years ago by a core team of Silicon Valley professionals. The team's roots coming from design for manufacturing and process development of Hybrid Circuits, Multi-Chip Modules (MCM), 2.5D & 3D Heterogeneous Integration, Chip-On-Board (COB), Chip-On-Flex (COF), PCB and RF Assembly. AmTECH processes include, flip chip C4 & TCB, die attach, wire bonding, ribbon bonding, dispense & encapsulation, and Surface Mount Technology (SMT)... AmTECH's teamwork experience started in the early 1990's designing and manufacturing hundreds of these electronic devices, combining multiple materials, components, assembly technologies and manufacturing processes on Rigid & Flex PCB laminates, and ceramic substrates.

Primary location: Morgan Hill United States