ANODIC BONDING

Substrates used for Anodic bonding create strong, hermetic bonds between materials, such as silicon and glass. Anodic bonding is used in the production of microelectronic devices, MEMS sensors, and microfluidic devices, among others. This technique offers high bond strength, excellent hermeticity, and compatibility with a wide range of materials, making it a popular choice in many research applications... Anodic bonding offers several advantages over other bonding techniques, including high bond strength, excellent hermeticity, and compatibility with a wide range of materials. It is also a relatively simple and low-cost process, making it an attractive option for many research applications.