CHIPBOND

Chipbond Technology Corporation (hereinafter referred to as Chipbond) was founded in July 1997. As a downstream packaging and testing service provider in the semiconductor industry, Chipbond has its headquarters in Hsinchu Science Park.The Company was listed at Taipei Exchange (TPEx) for public trade in 2002 (Stock Code: 6147). Since then, we have expanded our operations to six locations and currently employ approximately 5,200 people. We are one of the few companies in the country that possesses a competitive advantage in the entire process of manufacturing, packaging and testing of driver ICs. Additionally, we are the world's largest packaging and testing facility for display driver ICs and hold a prominent position among the top ten semiconductor packaging and testing companies globally... Founded in July 1997, Chipbond is a leading packaging and testing service provider with various solutions of bump, test, and assembly for ICs. Chipbond is also a major OSAT for display driver ICs..

Also known as: CHIPBOND Technology Corporation

Primary location: Hsinchu Taiwan, R.o.c.