ISMAT

ISMAT brings a unique approach to Integrated circuit (IC) electronic package development and manufacturing. Relying on a patented substrate development process, electronic packages for various applications and with various functions can be created as needed. If a low cost electronic package is required, a package that provides basic functionality can be built. If the design requires thermal dissipation, then a heat sink can be added to the electronic package. If EMI shielding is required, an electrically grounded shield that protects the IC from external EMI or shield the surrounding components from EMI generated from the IC can be built into the package. Electronic package substrates can be developed with new materials that can be tailored to meet challenging environments the IC and electronic package needs to operate in. Welcome to a new way of looking at IC package substrates... IC packaging solutions for challenging environments. BGAs, flip chips, MEMs, EMI shielding product..

Also known as: ISMAT Corporation

Primary location: Union City United States