TECO IMAGE SYSTEMS (TIS) - Key Persons
Mr. Sung joined Teco Image Systems (TIS) as a Senior Vice President in 2017, and he has a responsibility for operational excellence of TDS (TIS Dongguan Factory) and Technology innovation of production engineering.
To reach world class factory operation, he chases TDS factory optimization and Innovation.
Mr. Huang joined Teco Image Systems (TIS) as Vice President of Operations in 2001, and was promoted to President in October of 2002. During his tenure, Mr. Huang has been responsible for expanding revenues, improving earnings-per-share by more than 2.5 times, and solidifying the company's position as global leader in MFP OEM/ODM solutions. Mr. Huang has also been responsible for strategic investment and completion of the company's ultra-modern manufacturing facilities in Suzhou, China.
Prior to joining TIS, Mr. Huang was responsible for business development at United Microelectronics Corporation, the world's second largest semiconductor foundry. Mr. Huang's exposure to international new business development, marketing strategy, corporate management, and semiconductor and microelectronics industries has enabled him to effectively guide the development and deployment of TIS' highly successful services and solutions.
Mr. Huang earned BS and Master's degrees in Electrical Engineering from Columbia University (USA) as well as a BA degree in Business Management from Japan's Keio University.
Mr. Wei joined Teco Image Systems (TIS) in 1997 as Assistant Manager for the company's Telecommunications Product Division, has since then served as Research and Development Division Manager and Vice President of R&D Operations, and now currently serves as Associate Vice President. Mr. Wei first joined the Teco Group of companies in 1981 and has since held numerous management level positions within Teco Electric, Teco Information Systems and Teco Image Systems.
Mr. Wei brings extensive product research and development experience and expertise to TIS. His direct work experience spans hardware design, software and firmware design, control systems, communications, optical systems, ASIC and system integration. Mr. Wei has played a lead role in the introduction of new products and technologies within the Teco Group, from the company's first thermal fax to today's increasingly sophisticated MFP devices, and is responsible for TIS' leadership position within the Taiwan industry.
Mr. Wei holds a BS in Electronics from Chung Yuan University.