AMERICAN DICING

Incorporated in 1993, American Dicing Inc. has experience in high precision dicing and scribing for the microelectronic and miniature fabrication industries since 1987. We offer a broad range of services from prototypes to production volumes and the capability to work with wafers up to 12" in size... Production facility for semiconductor and microelectronics industry. Services include wafer dicing, die sorting, die bonding and wirebonding.

Also known as: American Dicing, Inc.

Primary location: Liverpool United States