QUNWIN.COM

ChongQing Qunwin Electronic Materials Co, Ltd. is a national high-tech innovative enterprise specializing in r&d and production of electronic packaging materials. Our company has a number of related core technology patents.And it also is the owner of Taiwan and the mainland atomization forming BGA tin ball technology patent. Among them, the BGA tin ball less than 0.25mm is listed as one of the key projects of the national 863(" 863 "plan). The products comply with JIS Z3282-2006 standard and all have passed SGS certification. We have obtained ISO 9001 and 14001-2015 certificates... Our company is the largest manufacturer of BGA solder balls in China. We have excellent research and development ability of solder ball, which can produce and meet all kinds of specifications of BGA/CSP/SMT.