EMNSPC

Varadharasan M, Agonafer D, Khazraji AA, Shah J, Siddarth A, Hoverson J, et al. A thermo-mechanical study on vertically split distribution-wet cooling media used in data centers. In: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, August 27, 2018 - August 30, 2018. American Society of Mechanical Engineers (ASME); 2018. p. Electronic and Photonic Packaging Division. (ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018)... Thirunavakkarasu G, Saini S, Shah J, Agonafer D. Air flow pattern and path flow simulation of airborne particulate contaminants in a high-density data center utilizing airside economization. In: ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2018, August 27, 2018 - August 30, 2018...

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