TLS-DICING

TLS-Dicing is an ideal solution for wafer dicing that has many advantages compared to competing technologies, such as the currently established method of mechanical sawing as well as laser ablation... 3D-Micromac is the leading specialist in laser micromachining. Our experts develop processes and laser systems at the highest technological level. 3D-Micromac systems have been successfully implemented in various high-tech industries worldwide. That includes the photovoltaic and semiconductor industry, glass and display technology, micro diagnostics, and medical device manufacturing. Our target is completely satisfying customer demands, even on the most complex projects... 3D-Micromac adheres to high-performance and future-oriented micromachining processes at high production efficiency. Our technologies have set international standards for true innovation. Since we place great importance on continually expanding our know-how, we diligently keep up with the latest research. We combine..

Registration numbers: HRB 20011 (W)

VAT numbers: DE 813 557 520

Primary location: San Jose United States