DTIP

DTIP'2024 will be the 26th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique event aims to present the latest research in Design, Test, Integration and Packaging of Sensors, Actuators, Microsystems, MEMS, NEMS and MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems will be addressed in a single track Conference. After the successful 2023 edition in Malta, the 2024 edition will take place in the city of Dresden, Germany.