WAFER FAB

A die is a small block of semiconductor material, ceramic or glass on which a given circuit function is fabricated. Many dice are manufactured in large batches at the same time on a substrate or wafer in a series of successive photolithographic processes. Upon completion of the manufacturing process, the substrates or wafers are diced in many die. Substrate or wafer singulation also referred as dicing or sawing process is final critical step in WAFER FAB manufacturing process. Our company has undertaken the task to redesign and manufacture the future semiconductor and thin film WAFER FAB components. Our bare die TECHNOLOGIES are used in assembly of hybrid circuits and are compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies SMD. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the WAFER FAB has to survive on its own without the protection of a package. Known Good Die concept is..