SIEPIC

The topics covered at the workshop include: the design of co-packaging for electronics and photonics; electronic-photonic circuit co-design; optical interfaces using edge and grating couplers to fibre arrays; design for test; design for packaging; ceramic carrier and printed circuit board design for DC and RF interfaces; microwave modelling; thermal management; integration of silicon photonic chip in package; wire-bonding, flip-chip bonding, and aerosol printing of interconnects. Modelling and design tools are provided... This short course teaches students and industry professionals how to design integrated optical devices and circuits, using a hands-on approach with commercial tools. We will fabricate your designs using a state-of-the-art ($5M) silicon photonic rapid-prototyping 100 keV electron-beam lithography facility. We will measure your designs using an automated optical probe station and provide you the data. You will then analyze your experimental data.

Primary location: Vancouver Canada