SHINWA

Shinwa is focused on solder paste deposition for small component joining including 01005 resistors, Chip Scale Package interconnections and RF Shield soldering. Shinwa's Solder Paste Jetting systems can dispense a variety of Solder Paste formulations; type 4, 5, 6 and 7 formulations are successfully Jet dispensed. Dot size is dependent on Jet hardware selection, process parameters and solder paste properties such as maximum sphere or ball size, ball size distribution, metals to flux ratio and flux chemistry. Most paste formulations run at 400 to 500 dots per second or 1,440,000 dots per hour (DPH). Shinwa systems use both "Jetting" and "Jet Stamping" dispensing techniques in order to minimize dot size and solve access issues on populated substrates or in cavities... Founded in 1951, Shinwa Co. Ltd is a publicly traded company listed on the Tokyo Stock Exchange with headquarters in Nagoya, Japan. Shinwa has advanced engineering expertise in Precision Dispensing and Metal Joining..

Also known as: Shinwa Co. Ltd.