INNOOR

We have 20+ years of experience in front end engineering in microelectronics (chip-scale, wafer-level and 3D packaging and interconnect of memory, processor, MEMS and sensors) and consumer electronics (embedded sub-systems such as memory modules and System-in-Package (SiP), and full products such as wearable health trackers, headphones, etc.) We have helped file 100+ patents and develop 10+ technologies and products, carrying out all the tasks listed on this website... Engineering consulting and support for New Product Introduction (NPI), Research and Development (R), and innovation/Intellectual Property (IP) development; from concept design and simulation to product development and research documentation