LEIMSA

LEIMSA - Lightweight Electronics by Injection Molding in Seamless Architecture Project was presented with great success at the LOPEC fair (International Exhibition and Conference for the Printed Electronics Industry), in Munich, in March. This printed electronics fair takes place annually and presents innovative solutions in technologies associated with printed electronics on different surfaces, materials and …... LEIMSA also aims at the capacitation of the consortium as well as the creation of robust value chain.

Primary location: Munich Germany