SEMI-CONN NE

A quality based, integrity bound company focused on helping customers reach their goals of repeatability for reliability and functionality... Semi-Conn NE (North East) focuses on interconnecting chip technologies to standard or custom interfaces for high tech companies performing reliability and/or functionality testing. We ultrasonically wedge bond diced chips using 1m Al / 1% Si wire with manual or automatic bonding systems... Our current customers utilize standard Kyocera side brazed DIP packages of different pin counts, materials, and well sizes based on chip dicing parameters. Our bonding systems are versatile and will accept a variety of die packages allowing us to participate in many different sectors of the industry. We die attach using high temperature RTV or epoxies. Coupled with another qualified vendor in New York, each with over 30 years of experience in the industry of packaging chip technologies, we can dice wafers of different diameters.

Also known as: Semi-Conn NE, LLC

Primary location: Poughkeepsie United States