CMP & WET

Chemical Mechanical Polishing (CMP) and WET Processing are widely used in semiconductor device and micro-electro-mechanical systems (MEMS) manufacturing. There is not any modern IC or MEMS that has not seen a good number of CMP steps and WET treatments within its fabrication process. Although looking quite simple on a first view, both technologies are rather complex. Solid physical-technical knowledge combined with experimental spirit are cornerstones for any process development in these fields.