STRETCHABLE ELECTRONICS - Key Persons
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- Group Leader Carsten Brockmann
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- Deputy Head of Department, Site ASSID
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- Group Leader Robert Hahn
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Christian Tschoban was born on 25. February 1985. He studied electrical engineering at the Dresden University of Technology and received his Dipl.-Ing. degree in 2010. Since then he has been working as a research engineer at the Fraunhofer Institute for Reliability and Microintegration. Currently, he is pursuing his Ph.D. degree in signal and power integrity design.
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- System
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- Head of Department WLSI, Site ASSID / Fraunhofer Institute
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- System
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- Head of Department, Group Leader Assembly and Encapsulation
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- Head of the Department Harald Pötter
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- Head of the Department Ivan Ndip
Professor Ivan Ndip joined Fraunhofer IZM Berlin in March 2000.
He led the RF group from 2005 to 2015. During this decade, he and his team significantly expanded the RF focus at Fraunhofer IZM and established new R&D topics such as antenna development, RF front-end integration, signal integrity and high-speed system design for various applications, including radar sensing, RFID, optical and satellite communications.
Since 2014 he has been head of the RF & Smart Sensor Systems department at IZM. He introduced 5G mmWave and 6G THz research at IZM and has been leading 5G and 6G projects with national and international partners since 2018. Since 2019, he has also been head of the IZM branch lab for High-Frequency Sensors and High Speed Systems in Cottbus.
To fund his teams at IZM, Ivan Ndip has acquired tens of millions of euros over the past 18 years from companies in the US, Europe and Asia, as well as from public funding agencies in Europe.
He taught graduate courses on electromagnetics of microsystems, electromagnetic compatibility (EMC) in electronic systems and high-frequency measurement techniques at the Technische Universität (TU) Berlin for 11 years (2008 to 2019). Since 2008, he has also been teaching Professional Development Courses (PDCs) to engineers and scientists worldwide.
Since February 2023, he has been a full professor and head of the Chair of Antennas and High-Frequency System Integration at the Brandenburg University of Technology Cottbus-Senftenberg (BTU).
Professor Ndip is an internationally recognized expert in the fields of integrated antennas, high-frequency/high-speed modules, signal/power integrity design and RF/mmWave packaging for a wide range of applications. He is an inventor and holds more than 30 US, European and German patents. Some of his patented Antenna-in-Package (AiP) and RF system integration solutions have been used in many research projects for the development of miniaturized hardware modules for 5G mmWave and 6G THz communication, as well as for proximity sensing and hardware security.
Ivan Ndip is the author and co-author of more than 230 publications in referred journals and conference proceedings. His research has been recognized with numerous Best Paper Awards at leading international conferences as well as with Best Journal Paper Award. He is also a recipient of the Tiburtius Prize (Preis der Berliner Hochschulen), awarded annually for outstanding Ph.D. dissertations in the state of Berlin. In 2012, he received the Fraunhofer IZM Research Award for his work on the development and successful application of novel methodologies, models and design measures (M3-approach) for optimization of high-frequency and high-speed systems. In 2016, he received the John A. Wagnon Technical Achievement Award from the International Microelectronics Assembly and Packaging Society (IMAPS) for his outstanding technical contributions to the microelectronics industry.
Professor Ndip is a Fellow and Life Member of IMAPS as well as a Senior Member of IEEE. He served on the Executive Board of IMAPS USA as Director from 2016 to 2020. He is a member of the technical program committee of many IEEE and IMAPS international conferences. He has been the Technical Co-Chair, Technical Chair and General Chair of several IMAPS International Symposiums on Microelectronics in USA, as well as the General Chair of IEEE Workshop on Signal and Power Integrity (SPI) in Berlin. He is an Associate Editor of the Journal of Microelectronics and Electronic Packaging, and serves as reviewer for many IEEE Journals and Nature Communications.
Ivan Ndip studied electrical engineering at TU Berlin. He received his Dipl.-Ing. (M.Sc.), and Dr.-Ing. (Ph.D.) with the highest distinction (summa cum laude), from TU Berlin in 2002 and 2006 respectively. In 2017, he received his second doctorate, Dr.-Ing. habil., also in electrical engineering from BTU Cottbus-Senftenberg, Germany.
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- Director of Fraunhofer IZM
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Professor Martin Schneider-Ramelow, born in Germany's Emsland region near the Dutch border in 1964, studied materials science at the Technical University of Berlin between 1987 and 1991. He completed his doctorate in materials engineering in 1998.
Between his graduation in 1991 and 1998, he stayed at the TU Berlin as a research associate, spending the first year at the Institute of Metallurgy before moving to the Institute for Materials Science and Engineering.
In August 1998, Martin Schneider-Ramelow joined Fraunhofer IZM in Berlin, initially as a Project and Group Leader (Chip and Wire Technologies). From 2008 to 2018, he was in charge of the System Integration and Interconnection Technologies (SIIT) operations, where his track record included an almost two-fold increase of the department's budget to more than 12 million, with an expansion of the share of industrial projects from approx. 35% to approx. 45%.
In 2014, he returned as a visiting lecturer to his alma mater, where he was appointed as full professor of "Materials for System Integration" in January 2017. Based at the Institute of High-Frequency and Semiconductor System Technologies in the university's Electrical Engineering and Computer Science department, his work includes the deputy directorship of the Research Centre for Microperipheral Technologies.
In 2023, Martin Schneider-Ramelow was appointed as the Director of Fraunhofer IZM. In this position, he predominantly concentrates on the strategic direction of the Institute's activities, including the coaching and professional development of the Institute's staff and the implementation of the strategy audit's recommendations.
He is also intensifying his work as a doctorate and postgraduate supervisor and actively developing new mentoring programmes.
Martin Schneider-Ramelow is the prolific author and co-author of more than 250 papers in his field and is considered a specialist for the quality and reliability of metallic interconnects and an internationally recognized expert for wire bonding technology. As such, he contributed substantially in his role as the Chair of the working group 2.4 "Bonding" of the German Welding Society DVS to the new edition of the DVS standard 2811. Replacing its predecessor after 20 years, the new document issued in 2017 has become the standard reference for evaluating high-quality wire bonds.
He is also a member of six national and international conference programme committees in the field of electronic packaging, a Senior Member of the IEEE, and Fellow of IMAPS USA, and in 2020 celebrated his tenth year as the Presiding Chairman of the International Microelectronics and Packaging Society (IMAPS) Germany.
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